ABOUT USHistory
2000
- 12
Introduced the World's First 40nm Class 2Gb GDDR5 DRAM
- 10
Introduced the Second Generation 1Gb DDR3
- 08
Introduced 4Gb Mobile DDR SDRAM Supported on Intel’s Moorestown Platform
- 04
Developed the world’s first Low Power-High Speed Mobile 1Gb DDR2 DRAM
- 03
Announced the world’s first 8GB 2-Rank DDR3 R-DIMM validation
- 02
Developed the world’s first 44nm DDR3 DRAM
- 01
Acquired Intel validation for the world’s first ultra-high speed DDR3 based module for servers 4GB ECC UDIMM
- 12
Developed the World’s First 2Gb Mobile DRAM
- 11
Introduced Industry's Fastest 7Gbps, 1Gb GDDR5 Graphics DRAM
- 08
Completed Construction of 300mm Fabrication Plant of 3rd Factory in Cheongju
US decided to Lift Countervailing Duty Order on DRAM
Demonstrated World’s First 16 GB 2-Rank R-DIMM Using MetaRAM™ Technology
Numonyx and Hynix Extend Efforts to Introduce New, Innovative NAND Flash Memory Products and Technologies - 07
Announced Closure of Eugene Fabrication Plant
- 05
Signed amendment to strengthen long-term strategic alliance with ProMOS
- 04
Released the 'Sustainability Report'
Applauded the Council of the European Unions move to lift countervailing duties on Hynix DRAMs
Developed the world's fastest Mobile LPDDR2
Signed license and joint development agreement on Spin-Transfer Torque MRAM (STT-RAM) with Grandis - 03
Announced new Board of Directors
Contracted with Fidelix for strategic alliance - 02
Introduced 2-Rank 8GB DDR2 RDIMM
Announced strengthening R&D sector - 01
Signed an agreement for cooperating joint R&D program of next-generation non-volatile memory technology
Arranged Toyota benchmarking program in order to establish innovative system
Announced 800MHz, 1GB/2GB UDIMM Validation
Held a strategic management workshop for sustainability management
- 12
Successfully offer global convertible notes
Opened a New Webpage - 11
WTO upholded ruling against Japan over punitive tariffs on imports of Hynix chips
Signed on CIS business cooperation with SiliconFile
Introduced 'New Working Board System'
Acquired Intel validation for 1Gb DDR2 DRAM
Developed industry's first 1Gb GDDR5 DRAM - 10
Signed an agreement for cooperating environmental management with Korean Federation For Environmental Movement
Signed technology and licensing agreement for PRAM with Ovonyx - 09
Hynix-ST Semiconductor Ltd. Signed to Sell 200mm Equipment to CRH
Developed the world's first NAND Flash MCP with 24 stacked chips - 08
Reached license agreement with ISi on Z-RAM memory technology
Developed industry's fastest, smallest 1Gb Mobile DRAM
- 07
Announced corporate slogan 'Good Memory'
Announced corporate mid-long term master plan - 05
Developed the industry’s first NAND Flash 24 stacks multi chip package
Acquired the industry's first validation on DDR3 DRAMs from Intel - 04
Achieved the top-level operating profit margin
Launched mass production of DOC H3 - 03
Appointed Mr. Jong-Kap Kim as the new Chairman & CEO
Reached patent cross license agreement and signed MOU to form joint venture for x4 technology with SanDisk
Signed semiconductor patent cross licensing and supply agreements with Toshiba
Announced 'ECO Mark'
Developed the world's fastest ECC Mobile DRAM
Announced new Board of Directors - 01
Posted record revenue and profit for 2006
Developed the fastest memory module based on 'Wafer Level Package' technology
- 12
Announced industry's first 60nm 1Gb DDR2 800MHz based modules
Developed the world's fastest 200MHz 512Mb mobile DRAM - 10
Posted record high revenues since foundation
Established a global manufacturing network with complete construction of Hynix-ST Semiconductor Inc
- 09
Launched 300mm research fab line
- 03
Acquired the industry's first validation on 80nm 512Mb DDR2 DRAMs from Intel
- 01
Announced joint development plan of DOC H3 (new generation DiskOnChip embedded flash drive) with M-Systems
- 12
Developed the world's first 512Mb GDDR4, the industry's fastest and highest density graphics DRAM
- 11
Launched the industry's first JEDEC standard 8GB DDR2 R-DIMM
- 07
Received industry's first Intel validation on high density-high speed 2GB DDR2-667 SODIMMs
Emerged from Corporate Restructuring Promotion Act ahead of schedule - 06
Developed industry's first ultra-high-speed DDR2-800 memory module and received validation from Taiwan-based ASUS
- 05
Began mass production of chips from 12-inch plant, M10
- 04
Launched Hynix-ST joint venture construction in Wuxi City, Jiangsu Province, China
- 03
Posted record high operating profit for year 2004 as a whole
- 01
Developed x8-based memory modules for servers with 30 pct higher power efficiency
Signed strategic alliance contract with Taiwan's ProMOS Technologies
- 11
Signed contract with STMicroelectronics for setting up plant in China
- 10
Completed sale of non-memory business
- 08
Signed contract with Wuxi City government for setting up plant in China
- 06
Signed non-memory Business Transfer Agreement with System Semiconductor
- 03
Acquired DDR2 SDRAM validation From Intel
- 02
Developed 512Mb NAND flash memory
- 12
Acquired 512Mb DDR2 SDRAM validation from Intel
- 09
Received fourth consecutive year Partners in Performance award from Selestica
- 08
Developed 0.18-micron high voltage process technology
Developed 1Gb DDR2 RAM - 07
Produced ultra-speed 256Mb DDR500
- 06
Acquired 512Mb DDR400 validation from Intel
Produced organic EL driver capable of lighting in 4,096 colors
Established research lab for environment, safety and technology
- 05
Started mass production of ultra-low power 256Mb SDRAM for mobile phone use
Succeeded in mass production of 0.10-micron "Golden Chip" - 04
Strategically cooperated with STMicroelectronics in flash memory development
- 03
Developed commercialization technology of Fe RAM
Produced CMOS high-frequency PLL IC chip - 02
Acquired 256Mb DDR 400 validation from Intel
- 01
Acquired 333Mbps ultra-speed 512Mb DDR SDRAM validation from Intel
- 11
Spun off HYDIS (TFT-LCD)
- 09
Signed MOU to spin off Hydis
- 08
Developed the world's first high-density, wide-bandwidth 256MB DDR SDRAM
Opened local website for memory module sale - 07
Developed bluetooth 'Embedded Flash Base-Band Chip'
- 06
Developed the world's first 256MB SDR SDRAM for high-end consumer application
- 05
Signed long-term agreement for foundry supply with Cirrus
- 03
Developed 1Gb DDR DRAM module
- 02
Acquired validation for DDR SDRAM from VIA
- 01
Signed agreement to transfer stake in "Hyundai Syscomm"
- 12
Developed the world's fastest 128Mb DDR SDRAM
- 10
Developed 8bit MCUs for car audio use and started mass production
- 09
Sold TFT-LCD assets for $650m
- 08
Completed separation from Hyundai Group
- 07
Spun off CDMA Mobile Communication Equipment Manufacture Unit to 'Hyundai Syscomm'
Launched mass production of MCU for flash memory cards - 06
Spun off Hynix's Management Supporting Unit to "ASTEC"
Entered "Multi Chip Package" market
Developed two types of 32Mb super-low power flash memory - 05
Spun off Network Business Unit to 'Hyundai Networks'
Completed official spin-off of ADSL operation
Developed 1Mb FeRAM
Completed official spin-off of handset operation to “Hyundai CuriTel”
- 04
Started mass production of the world's fastest DDR SDRAM for graphics
Introduced new CI
Acquired 288Mb RDRAM validation from Rambus - 03
Started to supply DDR SDRAM module for main memory to Compaq Computer Corporation
Changed the Company name to 'Hynix Semiconductor Inc.'
Developed 8Mb super-low power SRAM
Spun off Customer Service Operation to 'Hyundai Digitech Service' - 02
Sold Hyundai Electronics basketball team to KCC
Spun off Satellite Service Unit
Acquired validation from AMD and VIA for 128Mb and 256MB DDR SDRAM
Signed contract with Hewlett-Packard for exclusive memory module supply - 01
Received certificate on health and safety category from British Standards Institution
Developed Korea's first Pb-free semiconductor
- 12
Acquired Telecommunications Leadership 9000 certification
Developed 256MB micro-semiconductor module - 10
Launched collaborative product & process innovation system
Entered India's CDMA WLL equipment market
Proclaimed new slogan as "Human & Digital" - 09
Adopted corporate research commissioner system
- 08
Developed new 15.0/18.1 inch TFT-LCD module
Launched satellite communications service for Asia-Pacific region
Spun off Monitor Business Unit to "Hyundai Imagequest"
Spun off PDP Business Unit - 07
Strategically cooperated with LG Electronics in semiconductor business
Received validation for electric money in China
Initiated global cash management system with Bank of America
- 06
Begun mass production of world-class 18.1-Inch TFT LCD monitor
Launched new photoresist for semiconductors
Entered Brazilian WLL terminal market - 05
Acquired ISO 14001 from LRQA for environment-friendly management in all business units
Exported ADSL system firstly in Korea - 04
Sold Scotland's semiconductor factory to Motorola
Succeeded in developing new Ferrolectric RAM, FeRAM
Started production of ultra-low voltage flash memory
Started mass production of MCU for recharging battery
MPEG-4/7 technology was selected as international standard - 02
Received CMTL award from Intel at 'Intel Developer Conference'
