RoHS & REACH
RoHS
- Restrictions about the use of particular toxic substances within electrical and electronic equipments
- The objective of this type of legislation is to contribute to the protection of human health and the eco-friendly collection and disposal of WEEE in relation to the use of toxic substances in electrical and electronic equipments. New electrical and electronic products, which have not contained Phthalate materials such as lead, mercury, cadmium, hexavalent chrome, PBB or PBDE since July of 2006 and will not contain DEHP, DIBP, DBP, BBP, etc. from 2019, should be produced.
- 6 Critical Hazardous Substance
- Pb, Cd, Cr+6, Hg PBB (Polybrominated biphenyl), PBDE (Polybrominated diphenylethers)
- Thresholds For RoHS Substances
-
Thresholds for RoHS substances Substance MCV (Maximum Concentration Value) Cd < 100 ppm Pb < 1000 ppm Hg < 1000 ppm Cr+6 < 1000 ppm PBB < 1000 ppm PBDE < 1000 ppm DEHP < 1000 ppm DIBP < 1000 ppm DBP < 1000 ppm BBP < 1000 ppm
What is REACH
REACH abbreviate the words of Registration, Evaluation, Authorization of Chemical. REACH is a regulation to control and restrict chemical or product import by Registration, Evaluation, Authorization along the import quantity and degree of environmental risk. So material and product manufacturer needs to contol product composition and substance’s environmental risk management.
SK hynix Compliance Situation to REACH
SK hynix certify that SK hynix guarantee and comply to REACH regulation by below fact. SK hynix don’t have duty of registration by the reason that SK hynix’ products are classified as non-exposure article. SK hynix don’t have duty of notification by the reason that SK hynix’ product free from currently presented SVHC’s 46 substance. As guarantee SK hynix can share composing substance of product with customer by right appropriate process. SK hynix have been remaining relationship of communication about environmental information to confirm SVHC substance.
China RoHS
Overview
- Management Methods for Controlling Pollution by Electronic Information Products : Administrative guide and Management Methods on the Control of Pollution Caused by Electronic Information Products
- Enforcement period : March 1, 2007
- Requirement : Electronic Information Products Pollution Control Logos , Marking for Toxic or Hazardous Material or Elements, Recycle Mark of packing material
- hazardous substances : 6 Hazardous Substance. Pb (Lead), Hg (Mercury), Cd (Cadmium), Cr+6 (Hexavalent chromium), PBB , PBDE
| Substance | MCV (Maximum Concentration Value) |
|---|---|
| Cd | < 100 ppm |
| Pb | < 1000 ppm |
| Hg | < 1000 ppm |
| Cr+6 | < 1000 ppm |
| PBB | < 1000 ppm |
| PBDE | < 1000 ppm |
Electronic Information Products Pollution Control Logos
When hazardous substances are not used : hazardous substance safety mark is marked.
When hazardous substances are used : "Environmental Protection Use Period" is marked.
Marking for Toxic or Hazardous Material or Elements
- If a certain hazardous substance is not contained in the component or hazardous substance contained in the component is below the limit requirement in SJ/T11363-2006 : 'O' is marked.
- If hazardous substance contained in the component is above the limit requirement in SJ/T11363-2006 : 'X' is marked.
Recycle Mark of packing material
- This mark is attached to inner and outer packing Box.
- “CB” mean that the used packing material of products is Corrugated Cardboard.
- Standard : GB18455-2001 of China (Packaging Recycling Marks standard)
Component Product
- Electronic Information Products Pollution Control Logos :
- Marking for Toxic or Hazardous Material or Elements
| Part Name | Toxic or hazardous Substances and Elements | |||||
|---|---|---|---|---|---|---|
| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| Si CHIP |  |
|
|
|
|
|
| GOLD WIRE | |
|
|
|
|
|
| MOLD COMPOUND | |
|
|
|
|
|
| LEAD FRAME | |
|
|
|
|
|
| SUBSTRATE | |
|
|
|
|
|
| SOLDER BALL | |
|
|
|
|
|
- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
Module Product
- Electronic Information Products Pollution Control Logos :
- Marking for Toxic or Hazardous Material or Elements
| Part Name | Toxic or hazardous Substances and Elements | |||||
|---|---|---|---|---|---|---|
| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| Component | |
|
|
|
|
|
| PCB | |
|
|
|
|
|
| ACTIVEIC | |
|
|
|
|
|
| CAPACITOR | |
|
|
|
|
|
| RESISTOR | |
|
|
|
|
|
- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- Resister in module contains lead partially in order to electronic quality. It is impossible to unuse by present technological level
CIS Product
- Electronic Information Products Pollution Control Logos :
- Marking for Toxic or Hazardous Material or Elements
| Component Name | Hazardous Substances or Elements | |||||
|---|---|---|---|---|---|---|
| Lead (Pb) |
Mercury (Hg) |
Cadmium (Cd) |
Hexavalent Chrome (Cr6+) |
Polybrominated Biphenyl (PBB) |
Polybrominated Biphenyl Ether (PBDE) |
|
| Si CHIP | |
|
|
|
|
|
| GLASS | |
|
|
|
|
|
| SOLDER BALL | |
|
|
|
|
|
- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- LEAD FRAME : Part used in TSOP type / SUBSTRATE, SOLDER BALL : Part used in FBGA type
SSD Product
- Electronic Information Products Pollution Control Logos :
- Marking for Toxic or Hazardous Material or Elements
| Part Name | Toxic or hazardous Substances and Elements | |||||
|---|---|---|---|---|---|---|
| Pb | Hg | Cd | Cr6+ | PBB | PBDE | |
| PCB | |
|
|
|
|
|
| Solder Paste | |
|
|
|
|
|
| Active device | |
|
|
|
|
|
| Passive device | |
|
|
|
|
|
| Case | |
|
|
|
|
|
| Accessory | |
|
|
|
|
|
- : Indicates that toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006
- : Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part above the limit requirement in SJ/T11363-2006
- Passive device Resistor in SSD contains Pb (lead) partially for electronic quality. It is impossible for disuse at present due to technological matter.
Halogen Free
Hazardous halogen & the necessity for substitution
- What are the elements belong to the halogen family?
- They are fluorine, chloride, bromine and iodine, all of which are very active and used as a fire retardant for the semiconductor package material.
- Harmfulness & the necessity for substitution
- Toxic substances such as dioxin and difuran are generated if incinerated.
These substances tend to accumulate in a human body for a long period of time causing environmental hormone problems In particular fluorine, chloride and bromine are known to severe depletion of ozone layer when exposed to the atmosphere, and for this reason regulation is being increasing reinforced with EU leading such regulation trends.
EU and Japan are expected to take the lead in implementing the regulation beginning from 2008, and for this reason the halogen substance used for manufacturing the semiconductor must find a substitute.
Halogen-free Regulation Standards
-
JPCA(Japan Electronics Packaging and Circuits Association) JPCA-ES-01-1999 defines Circuits and method for "halogen-free“
Br < 0.09wt%(900ppm), CI < 0.09wt%(900ppm)
-
IEC(International Electrotechnical Commission) Finalized requirements of IEC 61249-2-21
- 900ppm maximum CI, 900ppm maximum Br
- 1500 ppm maximum total halogens
-
IPC - 4101B has adopted the IEC definition of halogen-free
- 900ppm maximum CI, 900ppm maximum Br
- 1500 ppm maximum total halogens
-
Note
fluorine, iodine, and astatine (other Group VIIA halogens) are not restricted in the industry definition of "halogen-free“.
Mass Production Status
| PRODUCT | 07 | 08 | 09 | 10 |
|---|---|---|---|---|
| DRM |  |
|||
| NAND Flash |  |
|||
| CIS |  |
|||
Identify the halogen-free products
| FROM | TO |
|---|---|
| HXXXXXXXXXP-XXX | HXXXXXXXXXR-XXX |
| P:RoHS Compliance | R:RoHS Compliance + Halogen Free |
Letter of Guarantee
| PRODUCT | Package | RoHS | REACH | PFOS | HALOGEN FREE |
|---|---|---|---|---|---|
| DRAM | Component | Satisfy Certificate [156KB] | Satisfy Certificate [334KB] | Satisfy Certificate [95KB] | Partly Satisfy Certificate [93KB] |
| Module | |||||
| NAND Flash | Component | ||||
| MCP | Component | ||||
| CIS | Component | ||||
| SiP | Component | ||||
| SSD | Component |
※ Halogen Free product information will vary depending on the warranty that can be regulated by our warranty will be distributed.
